Trimble 0-60 Challenge 2025 Demo Day!

trimble 0-60 challenge

The final countdown is on! With only two weeks remaining, the anticipation is building for the Trimble 0-60 Challenge Demo Day at Trimble Dimensions in Las Vegas, November 10-12, 2025. This highly-anticipated event is your chance to see the future of the Architecture, Engineering, Construction, and Owner-Operator (AECO) industry firsthand.

Our incredible finalists, innovators from around the globe, will showcase their high-impact integrations, demonstrating how they are expanding the Trimble Inc. ecosystem and tackling the industry’s toughest challenges. These cutting-edge solutions, leveraging platforms like Trimble Connect, SketchUp, and Trimble Tekla, are poised to transform the way we build and operate. Attendees will discover who will win the top cash prizes.


Trimble 0-60 challenge finalists datagrid, join kamai, kestrel labs, now vision.ai, navlive, testfit, swapp, qonic, kope, machasys


Spotlight on Our Top 10 Presenting Finalists:

  • Datagrid: The AI Agent that takes action, automating entire workflows across tools, files, and systems, and connecting to over 100 platforms.
  • Join: Collaborative software that manages design and preconstruction, uniting contractors, owners, and design teams around cost, timeline, and design clarity.
  • Kamai: An AI Co-Pilot for contractors built to automate blueprint takeoffs, extract quantities, and streamline estimates from a single PDF.
  • Kestrel Labs: Redefining code compliance as a catalyst for better design by giving architects and builders real- time clarity on what the rules allow.
  • KOPE AI: A software platform enabling Productization in construction, applying real-world building products to projects instantly using computational technology.
  • Mechasys: Pioneers in Projected Reality solutions, designing and manufacturing robotic laser projectors that display blueprints at true 1:1 scale with millimetric accuracy.
  • NavLive: Develops an AI-powered handheld scanner that generates real-time 2D and 3D models and instant 3D Point Cloud Data using LiDAR and AI processing.
  • Now Vision: Aims to automate construction monitoring by comparing site conditions with plans, schedules, and project documents in real-time, using AI to detect deviations.
  • Qonic: A lightning-fast, cloud-based BIM modeling platform for unmatched accuracy and seamless collaboration in the AEC industry.
  • SWAPP: Integrates advanced AI with human expertise to automate architectural documentation and modeling tasks, aiming to reduce documentation time by up to 50%.
  • TestFit: Their real estate feasibility platform makes site planning easy, with real-time AI iterating rapidly to optimize for the best use of land.

A huge shoutout to all the other innovative finalists and honorable mentions for their groundbreaking work: Genda, Permio, Qubu, Ulama, and Sensori. These companies represent the next big ideas in AECO.

Join us for the Trimble 0-60 Challenge Demo Day at Session Q-1794 to witness the innovation firsthand!

Last call for startups! Don’t miss your final opportunity to leverage the Trimble Ventures discount for Trimble Dimensions registration.

See you in Vegas!

#Trimble060Challenge #AECO #Innovation #Startups #TrimbleDimensions


About Trimble Connect

Trimble Connect is a cloud-based collaboration platform that enables teams to share, manage, and access project data from anywhere, ensuring stakeholders have the most up-to-date information for streamlined workflows. It is widely used across various sectors and industries including civil construction, geospatial, transportation, engineering and design. To learn more about Trimble Connect and its offerings, please visit connect.trimble.com.

About Trimble

Trimble is transforming the way people move, build and live. Core technologies in positioning, modeling and data analytics connect the digital and physical worlds to improve our customers’ productivity, quality, safety, transparency and sustainability. For more information about Trimble (Nasdaq:TRMB), visit trimble.com.